Delos Pushes Interconnect Planning Into Fabric-Layer Co-Design
Delos is reframing interconnect as a fabric-level architecture decision, with MoXI aimed at unifying scale-up and scale-out planning across copper and optical paths.
What is this trend?
Delos is turning interconnect planning into a fabric-layer co-design problem, where bandwidth, latency, topology, and media choices are set alongside the accelerator and memory stack.
- MoXI spans scale-up and scale-out fabrics across NVLink, UALink, Ethernet, and InfiniBand.
- Delos is pairing copper and optical paths to make interconnect a system-level design choice.
- Latency and bandwidth targets are being optimized with package, card, and rack constraints together.
- Interconnect selection is moving earlier in the hardware design cycle, not later in integration.
- Engineers now need to co-model fabric, memory, power, and thermals as one architecture.
What’s the latest?
Delos Data this week unveiled MoXI, its “Nonstop AI Data Interface,” claiming more than 30 Tbps in chiplet form, 10+ Tbps with near-packaged optics, 400+ Gbps on a card, about 100 ns latency, and up t
How it developed
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