Grand process ups local chip game with hybrid bonding hub

Grand Process Technology has strategically partnered with Japan's Seiki Semiconductor to distribute advanced bonding and precision surface treatment equipment within Taiwan, a move designed to localize critical semiconductor packaging technologies. This collaboration not only enhances Taiwan's self-sufficiency in semiconductor manufacturing but also leverages Seiki Semiconductor's cutting-edge equipment expertise, positioning Grand Process as a key facilitator in the region's advanced packaging ecosystem.

Grand Process Technology has transformed its relationship with Japan's Aoboshi Advanced Materials from mere product distribution to a strategic technology-equity partnership, marking a pivotal upgrade that enables localized manufacturing and R&D of hybrid bonding technologies in Taiwan. This move culminated in the completion of the first-phase strategic investment, signaling a deeper integration that goes beyond channel distribution to establishing a robust local presence in advanced semiconductor packaging.

Leveraging its extensive equipment manufacturing expertise and the strength of Taiwan's integrated supply chain, Grand Process Technology is set to establish the island's first hybrid bonding equipment and materials solution center. This center will combine local manufacturing capabilities with top-tier R&D, significantly shortening lead times and validation cycles for foundry and advanced packaging customers, thereby filling a critical gap in Taiwan’s 2.5D and 3D packaging supply chain that has long depended on imports dominated by a handful of international players.

Chairman and CEO Chang Hung-Tai emphasized that this strategic shift from distribution to technology investment and localized production represents a milestone in deepening advanced technology roots within Taiwan. He highlighted how bonding technology is a critical node influencing next-generation chip performance and thermal yield, and how this move empowers the global supply chain through localization, enhancing Taiwan's semiconductor supply chain autonomy and resilience.

Institutional analysts recognize that Grand Process Technology’s investment in Aoboshi Advanced Materials fills a significant technology gap by extending its product portfolio beyond wet-process equipment into the vital bonding process segment. This expansion not only addresses a crucial missing link in the company’s offerings but also promises to inject new growth momentum into its mid- to long-term operations, contingent on the smooth progression of localized production and validation efforts.

Grand Process Technology's strategic investment in Japan's Aoboshi Advanced Materials marks a pivotal shift from mere channel distribution to a technology-equity partnership that enables localized manufacturing and R&D of advanced hybrid bonding technologies in Taiwan. This move fills a critical gap in Taiwan's 2.5D and 3D semiconductor packaging supply chain, injecting fresh momentum into the island's advanced semiconductor manufacturing ecosystem and addressing a previously missing piece essential for next-generation packaging solutions.

The hybrid bonding technologies localized through this partnership—namely hydrophilic hybrid bonding, surface activated bonding (SAB), and focus super atom beam surface trim and polish—are core innovations developed by Professor Emeritus Tadatomo Suga's research team and exclusively licensed to Aoboshi Semiconductor. These technologies are critical for enhancing next-generation chip performance and thermal yield, especially as AI and high-performance computing chips demand greater computing power and energy efficiency, underscoring the strategic importance of this localization effort.

By establishing Taiwan’s first hybrid bonding equipment and materials solution center that combines local manufacturing capabilities with top-tier R&D strength, Grand Process Technology leverages its deep equipment manufacturing expertise and Taiwanese supply chain integration to significantly shorten lead times and validation cycles for foundry and advanced packaging customers. This strategic initiative not only strengthens Taiwan’s supply chain autonomy and resilience but also represents a significant milestone in deepening advanced semiconductor technology roots locally, as emphasized by CEO Chang Hung-Tai.